势银芯链·2025-11-15 00:02Core Insights - The article discusses the growing demand for "big computing power" driven by advancements in AI and high-performance computing, highlighting the need for a transformation in chip manufacturing due to challenges like the "von Neumann bottleneck" and the slowdown of Moore's Law [2][3] - Heterogeneous integration and heterogeneous-hybrid integration technologies are becoming crucial for achieving high-performance, multifunctional electronic systems, supported by national policies promoting foundational research in advanced technologies [2][3] Group 1: Heterogeneous Integration - Heterogeneous integration focuses on integrating different semiconductor materials (e.g., silicon-based chips with gallium nitride and silicon carbide) into a single package to overcome physical limitations of single materials [3] - The main challenges include managing thermal expansion coefficient mismatches, material interface defects, and thermal management [3] Group 2: Heterogeneous-Hybrid Integration - Heterogeneous-hybrid integration combines different process nodes (e.g., 7nm logic chips with 28nm I/O chips) and functional modules (e.g., CPU, GPU, memory) using advanced packaging technologies to create system-in-package (SIP) solutions [3] - This approach aims to optimize cost and performance while addressing challenges such as interconnect standardization, yield control, and signal integrity [3] Group 3: Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous-Hybrid Integration Frontier Forum" in Ningbo on November 18-19, 2025, focusing on cutting-edge heterogeneous-hybrid integration technologies [4] - The forum will feature discussions on various topics related to heterogeneous-hybrid integration, with confirmed participation from several key industry players and research institutions [4][6] Group 4: Conference Details - The conference is expected to attract 300-500 participants and will include a range of presentations from experts in the field, covering advancements in semiconductor technologies and integration methods [36][37] - Registration details indicate different ticket pricing options, including early bird discounts and student rates [37]