玻璃基板，行了吗？

Core Viewpoint - Samsung Electronics is in early-stage discussions with Japanese substrate manufacturers, including its subsidiary Samsung Electro-Mechanics, to collaborate on next-generation semiconductor glass substrate technology, but formal sample evaluations are not yet complete [2][3]. Group 1: Collaboration and Development - Samsung Electronics is collaborating with three major substrate partners—Samsung Electro-Mechanics, Ibiden, and Shin-Etsu Chemical—for preliminary sample testing of glass core substrates, which is expected to enhance power efficiency and thermal resistance [2]. - The discussions regarding glass substrates have been ongoing for about one to two years, indicating Samsung's interest in adopting glass substrates to secure advanced packaging technology [2]. Group 2: Technical Challenges and Market Uncertainty - Industry experts believe that Samsung Electronics views glass substrates as a candidate for next-generation technology but has not established any concrete commercialization plans due to the lack of compliant samples from its partners [3]. - The samples provided by the substrate partners are still in very early stages and do not meet Samsung's size and characteristic requirements, leading to slow progress in commercialization discussions [3][4]. - There are significant technical challenges associated with glass substrates, such as the risk of cracks during manufacturing processes like single-crystal formation and through-silicon vias (TSVs), which raises concerns among engineers regarding the necessity of this investment [4].