FC-BGA，卖爆了

Core Insights - The demand for semiconductor packaging substrates, particularly Flip Chip Ball Grid Array (FC-BGA), is surging due to the rapid growth of artificial intelligence (AI) applications, with expectations of near-full capacity utilization within the next two years [1][2] Group 1: Capacity Utilization and Production - Samsung Electro-Mechanics reported a third-quarter capacity utilization rate of 72% for its FC-BGA packaging business, up from 63% in Q1 and 68% in Q2, indicating a steady increase [1] - Industry insiders noted that the production capacity utilization for Samsung's FC-BGA lines is approaching peak levels [1] Group 2: Market Demand and Client Expansion - The immense demand for FC-BGA is prompting Samsung Electro-Mechanics to increase its capacity utilization and expand its client base from existing customers like Amazon and AMD to new clients including Google and Broadcom [2] - Securities analysts predict that Samsung's FC-BGA capacity will be nearly sold out before 2027, highlighting the strong market demand [2] Group 3: Business Strategy and Future Outlook - Samsung Electro-Mechanics aims to diversify its business structure, shifting focus from IT products to high-value applications in AI and automotive sectors, capitalizing on the expanding AI market and ongoing infrastructure investments [2] - The company anticipates record sales for FC-BGA this year, driven by the full-scale supply of AI accelerator substrates since Q2, and expects double-digit sales growth next year through the acquisition of new clients [2]