是说芯语·2025-11-29 06:51Core Viewpoint - Apple is likely to adopt Intel Foundry's 18A-P process for producing low-end MacBook and iPad chips, which could mark a significant breakthrough for Intel's foundry business by securing a key external customer [1][4]. Group 1: Intel's 18A-P Process - The 18A-P process is a derivative of Intel's 18A technology, introduced during the "Direct Connect 2025" initiative, featuring Foveros Direct 3D hybrid bonding technology that enhances chip integration and performance [5]. - Apple has signed a Non-Disclosure Agreement (NDA) with Intel and has received the 0.9.1GA version of the PDK for the 18A-P process, with key simulations and PPA studies meeting expectations [4][5]. - If progress continues smoothly, Apple plans to start mass production of low-end M-series chips based on the 18A-P process as early as Q2 to Q3 of 2027, contingent on the quality of Intel's 1.0/1.1 PDK delivery [4][8]. Group 2: Market Impact and Strategic Positioning - Following the announcement, Intel's stock surged by 10.19%, indicating strong market confidence in the potential collaboration with Apple [2]. - Apple's projected shipment volume for low-end M-series chips is expected to reach between 15 million to 20 million units by 2027, which would significantly boost Intel Foundry's order volume and serve as a key growth driver [6]. - The collaboration reflects Apple's strategy to diversify its supply chain, supporting "Made in America" initiatives by utilizing Intel's advanced wafer fabrication facilities while still relying on TSMC for high-end chips [6]. Group 3: Industry Implications - The adoption of the 18A-P process by Apple could set a precedent, encouraging other fabless companies to follow suit, potentially making this process a mainstream choice in the mid-to-low-end chip market [8]. - The collaboration is still in the "intent stage," with the success of the partnership hinging on the validation of the 18A-P process's PDK sampling and Intel's production capacity and yield performance [8].