Rapidus挑战1.4纳米半导体壁垒
TSMCTSMC(US:TSM) 日经中文网·2025-11-30 00:30

Core Viewpoint - Rapidus aims to produce cutting-edge 1.4nm semiconductor technology by 2029 and is targeting 2nm production by 2027, but faces significant challenges in scaling and competition with TSMC [2][4][5] Group 1: Production Plans and Investments - Rapidus plans to start construction of its second factory in Chitose, Hokkaido, in 2027, with the goal of producing 1.4nm semiconductors by 2029 [2] - The company has submitted a business plan to the Japanese Ministry of Economy, Trade and Industry, proposing to invest over 3 trillion yen in the development and mass production of 1.4nm and 1nm semiconductors by 2031 [4] - Total investment is expected to exceed 7 trillion yen, with the Japanese government already committing approximately 2.9 trillion yen in support [4][5] Group 2: Funding and Financial Strategy - Rapidus needs to secure around 1 trillion yen in private investment and borrow over 2 trillion yen from private financial institutions before 2031 [5] - The company aims to go public by 2031 to reduce reliance on government funding and ensure the development of its 1.4nm products [5] Group 3: Competitive Landscape - The production capacity of Rapidus's first factory is expected to be between 25,000 to 30,000 wafers, while TSMC's main factory is projected to exceed 100,000 wafers, highlighting the scale challenge [8] - Rapidus is currently collaborating with AI semiconductor design company Tenstorrent, but needs to demonstrate production capabilities to attract more clients [7][8] - The Japanese government is actively supporting Rapidus in customer acquisition, indicating a strategic push to enhance domestic semiconductor capabilities [8][9] Group 4: Technological Development - The company is focusing on developing 2nm technology, with a target to start mass production by 2027, which is critical for its competitive positioning [5][7] - Rapidus employs a "single wafer" manufacturing process that allows for high-speed processing, claiming to be 2-3 times faster than TSMC during mass production [7]