半导体行业观察·2025-12-01 09:39Core Viewpoint - The forum focused on the integration of industry, academia, and research in the semiconductor sector, emphasizing the importance of collaboration for innovation and ecosystem development in the integrated circuit industry [2][28]. Group 1: Forum Overview - The "2025 Integrated Circuit Specialty Process and Advanced Packaging Testing Industry Technology Forum" was held in Chengdu, attracting over 600 representatives from more than 200 companies in the integrated circuit field [2]. - The forum was guided by various governmental and academic institutions, aiming to create a platform for deep integration of production, learning, research, and application [2][28]. Group 2: Key Events and Activities - A council appointment ceremony for the Integrated Circuit Alumni Association of the University of Electronic Science and Technology was held, with new members from various sectors of the industry being recognized [6]. - The Advanced Packaging and System Integration Pilot Platform was officially launched, enhancing public service capabilities in the advanced packaging sector [9]. Group 3: Main Forum and Discussions - The main forum featured six experts discussing topics such as "Technology Routes in the Post-Moore Era" and "Power Integration Specialty Processes," showcasing the intersection of innovation and industrial application in integrated circuits [11]. - Three specialized sub-forums and a roundtable forum were conducted, focusing on cutting-edge semiconductor materials and technologies, advanced packaging, and the construction of an alumni ecosystem [14][20]. Group 4: Investment and Development Insights - A roundtable discussion highlighted the semiconductor industry's transition to a 2.0 phase, emphasizing the importance of early and stable investments, as well as the pursuit of synergistic effects in mergers and acquisitions [22]. - The Chengdu-Chongqing region was identified as a strategic area for semiconductor development, leveraging local talent and manufacturing capabilities to enhance the industry [22]. Group 5: Future Outlook - The focus on AI inference chips and 3D packaging was emphasized, with a call for local governments to support educational institutions like the University of Electronic Science and Technology to foster innovation [23].