硅芯科技：以EDA+打造先进封装时代的产业桥梁

Core Viewpoint - The article discusses the advancements and challenges in the field of 2.5D/3D stacked chip EDA, highlighting the innovative solutions provided by Silicon Core Technology through their 3Sheng Integration platform, which aims to address the unique requirements of stacked chip design and manufacturing [1][12]. Group 1: Company Overview - Silicon Core Technology focuses on EDA for 2.5D/3D stacked chips, differentiating itself from over 70 traditional EDA companies by entering a new field from the start [3]. - The founding team has over 15 years of experience in 3D IC EDA research, having collaborated with IMEC, a pioneer in advanced packaging processes [4][12]. - The company has established partnerships with 80% of domestic advanced packaging lines, successfully implementing projects in silicon photonics, CPUs, and heterogeneous AI chips [12]. Group 2: Challenges in Advanced Packaging - The industry faces two core challenges: the lack of native toolchains for stacked chips and the need for deep collaboration across multiple dimensions [5]. - Stacked chip EDA tools differ significantly from traditional single-chip tools, requiring a complete reworking of underlying algorithms for layout, simulation, verification, and testing [5]. - The architecture design for stacked chips is a new segment that necessitates defining chiplets from a multi-chip interconnection perspective [5][9]. Group 3: 3Sheng Integration Platform - The 3Sheng Integration platform includes five centers, focusing on the reconstruction of traditional EDA segments and introducing new methodologies for stacked chip design [6][8]. - Key innovations include a layout and routing center that adapts to the unique requirements of multi-chip interconnections, and a simulation process that integrates real-time testing during design [8][9]. - The platform also features a multi-die testing fault tolerance center and a new architecture design exploration center, which are essential for the effective design of stacked chips [9][10]. Group 4: Competitive Advantages - Silicon Core Technology has minimal technological lag compared to international EDA giants, as it began its research in stacked chip EDA around the same time [12]. - The company emphasizes the importance of industrial iteration and collaboration with advanced packaging companies to leverage market opportunities [12]. - The EDA+ concept introduced by Silicon Core serves as a bridge between design and manufacturing, facilitating collaboration and integration within the advanced packaging ecosystem [13][15].