惊！！三星电子解散HBM团队

Core Viewpoint - Samsung Electronics has announced a significant organizational restructuring, dissolving its high bandwidth memory (HBM) special development team and integrating its personnel and operations into the DRAM development department to enhance operational efficiency and competitiveness [1][3]. Group 1: Adjustment Details - The restructuring indicates a shift from an independent "task force" model for HBM to a more integrated approach within the mainstream storage chip R&D framework [3][4]. - The original HBM team members will transition to the design team under the DRAM development department, with the former HBM team leader continuing to oversee the development of next-generation HBM products [3][4]. - This change reflects Samsung's confidence in its HBM technology, which is now deemed competitive enough to be integrated with core DRAM technology [4]. Group 2: Market Impact - Samsung's market share in the global HBM market fell to 17% in Q2, ranking third behind SK Hynix's 62% share [5][6]. - The company is optimistic about its market performance in the coming year, especially with the successful entry of HBM3E into NVIDIA's supply chain and all orders for HBM4 already sold out [5][6]. - TrendForce predicts that Samsung's market share in the global HBM market could exceed 30% by 2026, driven by increased production capacity and demand [6][7]. Group 3: Strategic Positioning - Samsung's restructuring coincides with a super cycle in the global memory market, with significant price increases observed in DDR5 memory chips [6][7]. - The company aims to solidify its traditional DRAM market while simultaneously expanding its high-end HBM product line, reflecting a dual-track strategy [6][7]. - The restructuring is part of Samsung's strategy to effectively integrate internal resources to seize market opportunities and enhance its market share [7].