三星制定芯片新战略

Core Viewpoint - Samsung Electronics is focusing on expanding its role in the artificial intelligence supply chain and enhancing its semiconductor business, particularly in high-bandwidth memory and wafer foundry services, as part of its strategic plan for 2026 [1][2]. Group 1: Strategic Developments - Samsung held a global strategy meeting to outline its development roadmap for 2026, following significant leadership changes [1]. - The company plans to allocate 60% of its high-bandwidth memory (HBM) capacity to ASIC customers by 2026, with its latest HBM4 chips undergoing quality certification by NVIDIA [2]. - Samsung is preparing to launch its $37 billion factory in Taylor, Texas, in 2026, which will utilize advanced 2nm technology, marking a critical component of its foundry strategy [2]. Group 2: Competitive Positioning - Samsung's wafer foundry division is under scrutiny as it aims to close the technology gap with TSMC, which holds over 70% of the global foundry market share, while Samsung currently has an 8% market share [2]. - The upcoming Galaxy S26 series is set to feature the new Exynos 2600 processor, developed using Samsung's 2nm process, although production yield remains a concern [3]. - Samsung's consumer electronics division is increasing investments in AI-driven features to maintain competitiveness against rising pressure from Chinese brands [3]. Group 3: Partnerships and Collaborations - Samsung's leadership, including Chairman Lee Jae-Yong, is engaging with key industry figures like Elon Musk and AMD's CEO to discuss semiconductor collaborations and enhance Samsung's position as a critical chip supplier in the U.S. [1].