AI芯片散热，中山大学团队发布新方案

Core Insights - The article discusses the development of a novel thermal interface material (TIM) that meets the stringent cooling requirements of AI chips, achieving a total thermal resistance of 1.8 mm²K/W, which is significantly lower than traditional materials [1][2][10] - The research highlights the effectiveness of a two-step ultrasonic-polishing treatment that enhances the thermal performance of graphite-silicone composite materials, making them comparable to liquid metal in terms of heat dissipation [2][3][10] Group 1: Thermal Resistance and Performance - The newly developed TIM exhibits an ultra-low thermal resistance of 1.8 mm²K/W at 50 psi, which is the lowest reported for solid-state thermal pads, second only to liquid metal [2][3] - The thermal conductivity of the material is measured at 460 W/mK, with a high compression strain of 45% under 50 psi pressure, demonstrating excellent thermal cycling stability [2][3] - The performance of the TIM in actual gaming laptop cooling tests is comparable to that of liquid metal, maintaining CPU temperatures around 86 °C [3][8] Group 2: Manufacturing Process and Advantages - The ultrasonic treatment creates micro and nano-scale defects in the graphite sheets, optimizing the contact between the TIM and the surfaces it interfaces with, thus enhancing heat dissipation [6][10] - The polishing process further reduces surface roughness from 34.5 μm to 11.1 μm, improving the overall thermal contact performance [6][10] - The manufacturing technique is noted for its simplicity, efficiency, low cost, and potential for industrialization, making it a viable option for mass production [2][3]