可靠吗?苹果考虑在印度封装iPhone芯片;腾讯升级大模型研发架构,姚顺雨出任首席AI科学家;小米发布最新MiMo大模型
雷峰网·2025-12-18 00:45

Key Points - Apple is in talks with Indian semiconductor manufacturers to assemble and package iPhone chips in India, marking a shift from just final assembly to more complex semiconductor packaging [4][5] - Tencent has upgraded its large model research architecture, establishing new departments to enhance its AI capabilities, with a former OpenAI researcher appointed as chief AI scientist [7][8] - Xiaomi's new model, MiMo-V2-Flash, was launched by "genius girl" Luo Fuli, achieving a top 2 ranking among global open-source models [12] - MiniMax and Zhiyu have passed the Hong Kong Stock Exchange hearing, aiming to become the first publicly listed large model companies [21][22] - Neta Auto has established a new company named "Qianhe Auto" for restructuring purposes amid financial difficulties [24][25] - OPPO's executive shared a humorous experience of meeting a fan while undergoing dental surgery, highlighting the company's engagement with consumers [27][28] - Meta is planning layoffs in its metaverse department, reallocating resources towards AI smart glasses due to better market performance [44][45] - BYD has commenced comprehensive testing of its L3 autonomous driving technology, having completed over 150,000 kilometers of road validation [34] - Xiaomi plans to invest approximately 400 billion yuan in R&D in 2026, as part of a larger 2 trillion yuan investment over the next five years [40][41] - iRobot has entered bankruptcy and is being acquired by its main manufacturer, Sunkwan Group, which will retain the iRobot brand and continue operations in China [39][40]