HBM设备，韩企遥遥领先

Group 1 - South Korean companies hold approximately 90% of the global market share for TC bonding machines, which are essential for manufacturing High Bandwidth Memory (HBM) [2] - SK Hynix and Samsung Electronics are leading the global HBM market, with South Korean firms solidifying their dominance in HBM manufacturing equipment [2] - Hanmi Semiconductor achieved a cumulative sales figure of $247.7 million (approximately 366 billion KRW) in Q3 this year, capturing a market share of 71.2%, ranking first in the TC bonding machine market [2] Group 2 - Hanmi Semiconductor entered the HBM equipment market in 2017 with the world's first TSV dual-layer stacked TC bonding machine and holds 150 patents related to HBM equipment [3] - The TC bonding machine market is expected to grow at an annual rate of approximately 13% until 2030, driven by increasing demand for HBM [3] - South Korean companies are actively developing next-generation hybrid bonding machines, which are considered crucial as the number of HBM layers increases [3]