独家丨瑞沃微半导体完成数千万元A轮融资

Core Viewpoint - The article highlights the innovative introduction of chemical I/O bonding technology into the semiconductor advanced packaging sector by Shenzhen Ruiwo Micro Semiconductor, which addresses traditional packaging challenges and enhances performance metrics. Group 1: Company Overview - Shenzhen Ruiwo Micro Semiconductor completed several million yuan in Series A financing, with investments from notable institutions such as CITIC Capital, West Lake Science and Technology Investment, and Nanshan Innovation Investment [2] - Established in December 2021, the company focuses on innovation and application of advanced semiconductor packaging technology, having developed a platform that integrates various advanced manufacturing techniques [2][3] - The company has filed over 40 patents, showcasing its commitment to innovation in the semiconductor packaging field [3] Group 2: Technology and Applications - The company's proprietary panel-level, room-temperature, pressure-free copper-gold chemical I/O bonding technology enables higher density bonding, improved thermal performance, and enhanced reliability, resulting in ultra-thin devices and modules [3] - The advanced packaging technology platform is versatile, covering a range of product categories including discrete semiconductor devices, MEMS, Micro-LED/Mini backlight, and flexible display modules, with applications in smartphones, tablets, wearables, data centers, and cloud computing [3] - The technology offers significant advantages in terms of production costs compared to traditional packaging methods, positioning the company favorably in a large and expanding market [4]