韩国半导体工程师学会预测：到 2040 年芯片制程将突破至0.2纳米

Core Viewpoint - The article discusses the future development of semiconductor technology as outlined in the "2026 Semiconductor Technology Roadmap" by the Korean Semiconductor Engineers Society, highlighting significant advancements and challenges in achieving sub-1nm wafer processes over the next 15 years [2][3]. Group 1: Semiconductor Technology Advancements - Samsung has launched the world's first 2nm Gate-All-Around (GAA) chip, Exynos 2600, and aims to achieve 1nm chip production by 2029 [2][3]. - The roadmap predicts that by 2040, semiconductor circuit processes will reach 0.2nm, marking the entry into the angstrom-level technology era [2]. - The roadmap focuses on nine core technology areas, including semiconductor devices and manufacturing processes, AI semiconductors, optical interconnects, and quantum computing [2]. Group 2: Future Projections and Innovations - Samsung plans to upgrade its 2nm GAA technology to a third generation, SF2P+, within two years, and aims to implement a new transistor architecture using complementary FETs (CFET) by 2040 [3]. - In the storage sector, DRAM technology is expected to shrink from 11nm to 6nm, while High Bandwidth Memory (HBM) is projected to upgrade from 12-layer stacking with 2TB/s bandwidth to 30-layer stacking with 128TB/s bandwidth [3]. - SK Hynix has developed a 321-layer stacked QLC NAND flash technology, with future projections indicating the potential for 2000-layer stacked QLC NAND flash [4]. Group 3: AI Chip Performance Expectations - Current AI processors can achieve a maximum computing power of 10 TOPS (trillions of operations per second), with projections indicating that by 15 years from now, chips for model training could reach 1000 TOPS, and those for inference tasks could achieve 100 TOPS [4].