日本组团搞存储，旨在干掉HBM

Core Viewpoint - Fujitsu is joining a project led by SoftBank to develop next-generation memory for artificial intelligence and supercomputers, aiming to revitalize Japan's memory production technology and position its companies among the world's top memory manufacturers [1][2]. Group 1: Project Overview - The newly established Saimemory company will coordinate the project, focusing on developing high-performance memory to replace current high-bandwidth memory (HBM) achieved through stacked DRAM chips [1]. - The project plans to invest 8 billion yen (approximately 51.2 million USD) to complete prototype development by the fiscal year 2027 and aims to establish a mass production system by the fiscal year 2029 [1]. - SoftBank will inject 3 billion yen into Saimemory before the fiscal year 2027, while Fujitsu and RIKEN will jointly invest about 1 billion yen [1]. Group 2: Technical Aspects - Saimemory aims to produce memory with a capacity two to three times that of HBM, with power consumption only half that of HBM, while maintaining similar or lower pricing [2]. - The project will utilize semiconductor technology jointly developed by Intel and the University of Tokyo, with production and prototyping in collaboration with Nikkon and Taiwan's Powerchip Semiconductor Manufacturing Corporation [2]. - Intel will provide underlying stacking technology, which allows for vertical stacking of chips, increasing the number of memory chips per device and reducing data transmission distances [2]. Group 3: Market Context - The demand for computing power in Japan is expected to grow over 300% by 2030 compared to 2020, driven by the rise of generative AI [2]. - Japan's semiconductor self-sufficiency is low, leading to risks of supply instability and price increases, with South Korean companies holding about 90% of the global HBM market share [2]. - The emergence of artificial intelligence is changing the industry landscape, with SoftBank building its own large data centers and Fujitsu developing CPUs for data centers and communication infrastructure, targeting practical applications by 2027 [3].