猛兽派选股·2025-12-26 16:01Core Viewpoint - AI computing power is the core growth engine for the PCB and copper-clad laminate industry, with high-end HDI/multi-layer boards and low-loss copper-clad laminates becoming key competitive factors [1][5]. Group 1: Copper-Clad Laminate (CCL) Manufacturers - The copper-clad laminate is a core substrate for PCBs, accounting for about 30% of PCB costs, with high technical barriers and long certification cycles leading to high industry concentration [1][6]. - Leading global manufacturers include: - Shengyi Technology: Mainland China's leader in copper-clad laminates, with M9 ultra-low loss products certified by NVIDIA, achieving over 90% yield [2]. - Kingboard Laminates: A global leader in scale, covering mid-to-high-end FR4 and low-loss series, with strong overseas delivery capabilities [2]. - Taiwan's Taisol and Panasonic: Key suppliers for NVIDIA, maintaining stable shares in ultra-low loss products [2]. - Domestic second-tier players like Huazheng New Materials and Jin'an Guoji are accelerating high-end breakthroughs, focusing on low-loss series for AI servers and communication equipment [3]. Group 2: PCB Manufacturers - The core competitiveness of PCB manufacturers lies in customer binding depth, high-end product technology, and overseas capacity layout [4]. - Leading North American players include: - Simmtech: A leader in high-end HDI and multi-layer boards, a core supplier for NVIDIA and other major clients [4]. - Unimicron: A benchmark for high-speed communication boards, with strong growth driven by AI and communication sectors [4]. - Domestic players like Shennan Circuits and Pegatron are positioned for long-term benefits from the rise of domestic computing power and breakthroughs in carrier boards [4]. Group 3: Industry Trends and Competitive Logic - Most PCB manufacturers do not produce their own copper-clad laminates due to high technical barriers and customer specifications [6]. - The competitive core dimensions focus on ultra-low loss product capacity, yield, and customer certification, as well as high-end HDI and multi-layer board technology breakthroughs [7]. - Short-term beneficiaries include Simmtech and Shengyi Technology, while mid-term beneficiaries are Shennan Circuits and Huazheng New Materials, with long-term potential seen in advanced packaging and carrier board manufacturers [7][8].