【1月8日15：00】锚定TGV工艺优化，LPKF & RENA解决方案已就绪

Group 1 - The core viewpoint of the article emphasizes the rising importance of glass substrates in semiconductor technology, particularly in the context of heterogeneous integration as a key pathway to enhance chip system performance and functionality [2] - Glass substrates are recognized for their high flatness, low thermal expansion coefficient, low dielectric loss, and excellent mechanical and chemical stability, expanding their applications from traditional display fields to advanced semiconductor packaging, MEMS, sensors, AI high-performance computing, 5G/6G RF communication, optoelectronic integration, and power semiconductors [2] - The article highlights the strategic significance of glass through-silicon vias (TGV) technology in achieving high-density heterogeneous integration and interconnection upgrades, which are essential for overcoming performance bottlenecks in the post-Moore's Law era [2] Group 2 - LPKF Laser & Electronics AG, established in 1976 and headquartered in Garbsen, is a leading supplier of innovative laser solutions, having developed specialized technologies and equipment for various industries including electronics, semiconductors, solar photovoltaics, medical, and automotive sectors [5] - The Vitrion brand under LPKF has introduced the LPKF LIDE laser-induced deep etching technology for processing thin glass, with applications in microsystems, sensors, high-density packaging in the post-Moore era, RF packaging, and display component production [5] - RENA Technologies GmbH is a global leader in wet chemical surface treatment equipment, providing high-value innovative solutions to help clients achieve higher standards in semiconductor, medical technology, glass, additive manufacturing, and renewable energy sectors [7] - RENA's modular equipment design and customized R&D capabilities enable it to offer high-precision wet chemical processing equipment and technical solutions to high-end manufacturing industries worldwide [7]