台积电2nm正式量产！

Core Viewpoint - TSMC has quietly commenced mass production of its N2 2nm process, aligning with its previously set timeline for 2025 [2][4]. Group 1: TSMC N2 Process Overview - TSMC's N2 process is the first to utilize GAA (Gate-All-Around) technology, specifically employing nanosheet transistors, marking a significant advancement in semiconductor manufacturing [4]. - The N2 process boasts a 1.15x increase in transistor density compared to the previous N3E process, with power consumption reduced by 24%-35% and performance improved by 15% [4]. - The SRAM density of the N2 process reaches a record 37.9Mb/mm², providing robust hardware support for high-performance computing and AI applications [4]. Group 2: Market Implications - Initial wafer foundry prices for the N2 process are expected to reach $30,000 per wafer, equivalent to over 200,000 RMB, indicating that only financially strong companies can afford this technology [4]. - Major clients such as NVIDIA, AMD, Apple, Qualcomm, and MediaTek are anticipated to utilize the N2 process as its production capacity ramps up [2][4].