三星半导体发奖金，比去年高300%

Group 1 - Samsung Electronics' semiconductor division (DS Division) employees will receive performance bonuses of up to 43%-48% of their annual salary in 2025, significantly higher than last year's 14% [1] - The increase in bonuses is attributed to rising DRAM prices and the full supply of the fifth-generation high bandwidth memory (HBM3E) [1] - The Mobile Experience (MX) department's bonus range is set at 45%-50%, slightly up from last year's 40%-44%, while the Visual Display (VD) department's range is 9%-12%, an increase from last year's 27% [1] Group 2 - Samsung plans to increase its HBM production capacity by 50% next year, focusing on supplying NVIDIA, its largest HBM customer [2] - By the end of 2026, Samsung aims to achieve a monthly production capacity of 250,000 HBM wafers, up from the current 170,000 wafers, representing a 47% increase [2] - The investment will include upgrading existing production lines and expanding the P4 production line, with major facility investments expected to start next month [2] Group 3 - NVIDIA confirmed in October that it will use Samsung's HBM4 chips, driven by the growing demand for HBM due to the AI investment boom [3] - HBM4 will be integrated into NVIDIA's AI semiconductor chip Rubin, which is set to launch in the second half of next year [3] - Samsung's representative stated that the company is evaluating various measures to meet the rapidly growing demand for HBM, although specific plans are not yet confirmed [3]