半导体芯闻·2025-12-31 08:56Core Insights - Samsung Electronics' sixth-generation high-bandwidth memory (HBM4) achieved a record operational speed during technical tests led by Broadcom, outperforming competitors in performance validation for Google's eighth-generation AI accelerator, TPU v8 [1][2] - The HBM4 reached a speed of 11 Gbps during system-in-package (SiP) testing, marking it as the leader among the top three memory manufacturers, with superior thermal management ratings [1] - The results from the HBM4 tests are expected to strengthen the partnership between Samsung and Broadcom, as Google plans to offer TPU to external customers, potentially increasing Samsung's HBM supply significantly by 2026 [1] Industry Context - A senior industry executive noted that Samsung's record speed in Broadcom's tests demonstrates its competitive edge in integrating wafer foundry services with advanced packaging solutions, positioning Samsung favorably for securing Google supply chain orders in the coming year [2] - Alphabet Inc.'s latest "Gemini 3" chatbot has received positive reviews, with its in-house developed TPU becoming a crucial asset for supporting AI models [2] - Melius Research analyst Ben Reitzes highlighted that Google and Broadcom have been collaborating on custom ASICs since 2016, now reaching the seventh generation, with TPU being a significant player in AI workloads alongside Nvidia's GPUs [2]