2026年，半导体技术趋势预测

Core Viewpoint - The semiconductor manufacturing sector is poised to become the core of the next phase of digital transformation, driven by flexible ultra-thin chip technology that will foster innovation across various emerging product forms, enhancing functionality and energy efficiency in manufacturing processes [2]. Group 1: Technological Trends - Flexible ultra-thin chip technology will lead to new innovations in wearable and audible devices, achieving higher functional density in limited spaces and promoting more energy-efficient manufacturing models [2]. - The demand for low-power machine learning accelerators, sensor-integrated chips, and memory-optimized chips will dominate the market by 2026, indicating a shift towards specialized chips in the semiconductor field [6]. - Heterogeneous integration will drive manufacturing innovation by combining different processes to create powerful and cost-effective systems, surpassing traditional single-chip technologies to meet the demands of AI, 5G, and other industrial needs [6]. Group 2: Market Dynamics - Companies that incorporate interconnected technologies into their 2026 strategies will be better positioned to seize future digital transformation opportunities, enhancing innovation and consumer engagement [2]. - The transition from batch customization to AI-driven personalized products in sectors like smart packaging, healthcare, and logistics will reshape market dynamics [6]. - As regulatory frameworks become more refined, the focus will shift from cost to competition, with NFC applications helping companies meet compliance and governance requirements [6]. Group 3: Sustainability and Energy Management - There is a growing emphasis on energy-efficient infrastructure in semiconductor manufacturing, driven by the increasing energy consumption associated with AI [6]. - Companies that adhere to principles of circular economy, sustainability, and resilience are expected to gain a competitive edge in the market transformation [6].