硅基技术硬核赋能:上海朗矽科技携核心优势亮相2026半导体协同创新论坛
半导体芯闻·2026-01-04 10:17

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor industry's cross-domain collaboration and innovation [2][10]. Group 1: Event Overview - The forum is organized by Semiconductor Industry Observation and the Munich Shanghai Optical Fair, aiming to address the challenges of the semiconductor supply chain through a comprehensive approach from materials to applications [2]. - The event will feature 200 key industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted technical exchanges [3][13]. - The forum will utilize a hybrid model of offline and online participation to enhance industry impact and facilitate efficient technology showcase and business matching [3]. Group 2: Shanghai Langxi Technology - Shanghai Langxi Technology, established in March 2023, focuses on silicon-based passive devices and has rapidly developed into a benchmark enterprise in the high-end passive device sector [5][10]. - The company has achieved significant technological breakthroughs, including a three-dimensional capacitor structure that enhances performance metrics such as capacitance density and frequency characteristics [6][8]. - Langxi Technology has applied for 32 core patents, with over 60% being invention patents, establishing a comprehensive technical protection system [9]. Group 3: Technological Innovations - The company employs deep trench etching technology to create high aspect ratio three-dimensional capacitor structures, significantly increasing effective contact area and performance [6]. - It has developed a complete testing and simulation system to ensure the stability and predictability of its silicon-based passive devices, addressing industry pain points in high-frequency applications [7]. - The core products achieve a capacitance density of 2μF/mm² and an impedance of less than 5mΩ at 1GHz, with a lifespan exceeding 100,000 hours, making them suitable for high-end applications [8]. Group 4: Industry Impact and Collaboration - The forum aims to break down barriers between the semiconductor and communication industries, facilitating a collaborative approach to address challenges in the localization process [10][13]. - Langxi Technology's participation will provide insights into the silicon-based passive device sector, offering solutions for power integrity optimization and fostering connections between chip designers and core component manufacturers [10]. - The event is expected to serve as a crucial platform for technology cooperation, market expansion, and ecosystem building, benefiting both large and small enterprises in the semiconductor industry [13].