中国台湾，补贴三类芯片

Core Viewpoint - The Taiwanese authorities announced the "Advanced Development Subsidy Program for IC Designers" for 2026, prioritizing support for IC designers in developing chips for drones, robots, and satellite communications to maintain Taiwan's critical position in the global semiconductor industry [1]. Group 1: Subsidy Program Overview - The total budget for this subsidy program in 2023 is set at NT$1.75 billion, with a duration of no more than three years [2]. - The subsidies are divided into two categories: - The first category focuses on "advantageous chip" development, allowing single applications with a maximum subsidy of NT$200 million, targeting innovative chips that address industry technology gaps or market demands, particularly in drones, robots, and satellite communications [2]. - The second category is for "core chip and system development," which allows joint applications with a maximum subsidy of NT$300 million, aimed at developing high-value core chips and modules/systems in collaboration with local system operators [2]. Group 2: Targeted Chip Types and Specifications - The program specifies the types and specifications of chips eligible for subsidies, including: - Communication chips for the drone sector - Composite sensing and control chips for the robotics sector - Ku band RF chips for the satellite communications sector [2].