两大存储芯片厂，有新进展

Group 1 - SK Hynix's new factory in Yongin, South Korea, will activate its first cleanroom in March next year, two months ahead of schedule, indicating an acceleration in DRAM capacity expansion [1] - The first phase of the Yongin factory was originally planned to be completed by May 2024, likely to meet high demand for high bandwidth memory (HBM) chips used in AI [1] - SK Hynix plans to build a total of four wafer fabs in Yongin, which will be larger than the M15X factory [1] Group 2 - Samsung plans to resume construction of its advanced P5 wafer fab in Pyeongtaek next month, which was initially scheduled to halt in 2024 due to a downturn in the memory chip market [2] - The contract value for Samsung E&A with Samsung has increased to 550 billion KRW from the previously announced 391.5 billion KRW [2] - The P5 factory is designed to be three stories high, equivalent to the combined size of the P3 and P4 factories, which are both two-story structures [2]