16层HBM 4，首次公开

Group 1 - SK Hynix will showcase its next-generation AI storage solutions at the 2026 CES, themed "Creating a Sustainable Future with Innovative AI Technology" [1] - The company will unveil its 48GB 16-layer HBM4 product, an upgrade from the 36GB 12-layer HBM4, which has a leading data transfer speed of 11.7Gbps [1] - SK Hynix will also present the 36GB 12-layer HBM3E product, expected to be a core product in the HBM market in the first half of the year, along with AI server GPU modules [1] Group 2 - The new generation of general memory products includes the LPDDR6 memory, which significantly enhances data processing speed and energy efficiency for AI applications [2] - In the NAND flash sector, SK Hynix will launch a 321-layer, 2Tb capacity QLC product optimized for large-capacity enterprise SSDs, driven by the growing demand from AI data centers [2] - An "AI System Demonstration Zone" will be set up for visitors to observe how the currently developed AI memory solutions integrate into a cohesive AI ecosystem [2]