长江存储Xtacking，谁与争锋？

Core Viewpoint - The article highlights the significant advancements and innovations in the 3D NAND flash memory technology developed by Yangtze Memory Technologies Co., Ltd. (YMTC), particularly through its Xtacking® architecture, which has achieved notable industry recognition and awards for its innovative design and performance improvements [3][9][11]. Summary by Sections Xtacking® Architecture Development - In 2018, YMTC launched the Xtacking® architecture, which separates the storage array and peripheral circuits onto different wafers for parallel processing, enhancing manufacturing flexibility and device compatibility [6]. - The architecture has evolved through several versions, with Xtacking® 4.0 currently offering improved interface speeds, higher storage density, and enhanced reliability [11]. Technical Innovations - Xtacking® 2.0 introduced a dual-stacking architecture that reduced the difficulty of etching channel holes, improving signal transmission performance and overall system performance [7]. - Xtacking® 3.0 simplified the manufacturing process by converting complex 3D structures into 2D, leading to cost reductions and improved read/write performance [8]. Performance Metrics - The Xtacking® 4.0 design features a chip size of 40.44 square millimeters, achieving a density of 12.66 Gb/mm² for a 512 Gb chip, thus providing higher storage density within a smaller area [9]. Industry Recognition - The Xtacking® architecture has received multiple awards, including the "Best of Show" at the Flash Memory Summit in 2018 and the "Most Innovative Storage Technology Award" at the FMS 2022 and FMS 2025, recognizing its contributions to the field of 3D NAND technology [9][11].