美股IPO·2026-01-07 16:20Core Viewpoint - Morgan Stanley has raised its CoWoS capacity forecasts for 2026 and 2027 by 8% and 13% respectively, driven by TSMC's capacity expansion and strong demand for TPUs [1][2]. Group 1: CoWoS Capacity Forecasts - TSMC's CoWoS capacity is expected to reach 115,000 wafers per month by the end of 2026, with additional capacity from external suppliers (mainly ASE and Amkor) contributing 12,000 to 15,000 wafers per month [2]. - The capacity increase is primarily due to rising demand from the ASIC supply chain, with TSMC focusing on CoWoS-L technology while CoWoS-S supply remains stable [2]. Group 2: TPU Demand and Shipments - Morgan Stanley has raised its TPU shipment forecasts for 2026 and 2027 to 3.7 million and 5 million units respectively, reflecting strong market demand and TSMC's ongoing capacity expansion [3][4]. - To meet TPU demand, Broadcom's CoWoS wafer allocation has been increased to 230,000 wafers in 2026 and 350,000 wafers in 2027, while MediaTek is expected to receive 18,000 and 55,000 wafers in the same years [5]. Group 3: Key Players and Projects - NVIDIA's CoWoS allocation for 2026 remains at 700,000 wafers, with slight adjustments in product mix due to HBM4 readiness issues [6]. - AMD's CoWoS forecasts remain unchanged at 90,000 and 120,000 wafers for 2026 and 2027, with potential delays in the MI450 project [6]. - AWS's Trainium project has seen a slight reduction in 2026 shipment expectations to 2.1 million units, with lifecycle totals unchanged [7]. Group 4: Outsourcing and Equipment Suppliers - Due to TSMC's capacity constraints, smaller projects are being outsourced to packaging factories, with ASE expected to benefit from various CPU and TPU projects [8]. - Equipment suppliers are projected to see a 20% to 30% increase in equipment shipments in 2026, driven by strong demand for CoWoS, WMCM, and FOCoS technologies [9].