信越进军芯片设备，大幅降低成本

Core Viewpoint - Shin-Etsu Chemical, the world's largest silicon wafer manufacturer, aims to cultivate new customers through a simplified back-end chip manufacturing technology and plans to provide new equipment and materials starting in 2027 to meet the demand related to artificial intelligence [1][2]. Group 1: Technology Development - The microfabrication technology being developed by Shin-Etsu utilizes lasers to simplify the process of attaching semiconductor chips to substrates, which is expected to increase demand for advanced AI chip manufacturing [1]. - This new technology can control processing precision errors within a range of 0.1 to 1 micrometer, significantly reducing heat generation and installation deviations compared to traditional chip bonding machines [1][3]. - The company claims that its new technology will reduce capital investment by approximately 15%, operational costs by about 20%, and equipment footprint by around 80% compared to using chip bonding machines [1]. Group 2: Market Strategy - Shin-Etsu plans to directly supply back-end chip manufacturers such as ASE Technology and continue collaboration with major chip companies like NVIDIA and TSMC for product development [2]. - The company aims to establish its microfabrication technology as the de facto standard for back-end chip manufacturing processes, leveraging its expertise in materials [3]. Group 3: Future Outlook - The advanced chips produced using Shin-Etsu's new microfabrication technology are expected to be primarily used in AI data centers, aligning with the company's goal to become a prominent player in the AI sector [2]. - The initial development of the microfabrication technology was for microLED applications, but the company recognized its potential for semiconductor production and other fields [3].