从TGV到各种玻璃微结构：LIDE技术解锁玻璃在先进封装中的全部潜力

Core Viewpoint - The article emphasizes the transformative potential of Laser-Induced Deep Etching (LIDE) technology in the semiconductor packaging industry, particularly in utilizing glass as a substrate for advanced packaging solutions. This technology addresses the increasing demands for high-density interconnections, efficient thermal management, and mechanical stability in semiconductor devices [2][19][22]. Group 1: Market Demand and Technological Advancements - The semiconductor industry's shift towards high-end chips like AI and HPC is driving the need for advanced packaging technologies that require higher bandwidth, lower power consumption, and smaller sizes [2]. - Glass is gaining attention as a promising material for semiconductor packaging due to its excellent thermal stability, electrical insulation, and optical transparency [3][19]. - There is a pressing demand for glass microstructures, including through-glass vias (TGV), blind vias, and microchannels, which are crucial for thermal management and high-density interconnections [2][3][19]. Group 2: Limitations of Traditional Glass Processing Techniques - Traditional glass processing methods, such as mechanical drilling and wet etching, have significant limitations, including the generation of defects, limited aspect ratios, and scalability issues [4][6]. - Mechanical drilling can induce high mechanical stress, leading to micro-cracks and compromised structural integrity [4]. - Wet etching methods struggle with aspect ratio control and are not suitable for mass production due to their complexity and cost [4][6]. Group 3: Advantages of LIDE Technology - LIDE technology combines laser modification and chemical etching to achieve high-precision glass microstructure fabrication, allowing for the creation of deep, narrow structures without defects [11][16]. - The two-step process of LIDE involves laser modification followed by wet etching, enabling the formation of complex microstructures with high aspect ratios and mechanical strength [10][11][16]. - LIDE technology supports the integration of various microstructures, such as TGVs, microchannels, and blind vias, on a single glass substrate, enhancing the functionality of semiconductor packages [13][19][22]. Group 4: Implications for Semiconductor Packaging - The integration of multiple microstructures using LIDE technology addresses the challenges of thermal management and sensor integration in high-power semiconductor devices [19][22]. - The formation of microstructures in glass substrates necessitates new requirements for the semiconductor supply chain and process integration, particularly in adapting back-end assembly and bonding technologies [20][22]. - Collaboration among material suppliers, equipment manufacturers, and semiconductor companies will be crucial for developing reliable and efficient processing systems as the industry transitions to complex glass substrate packaging [20][22]. Group 5: Future Outlook - LIDE technology is positioned to become a core driver of next-generation packaging technologies, solidifying glass materials' status as a mainstream substrate in high-end packaging applications [22].