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Core Viewpoint - The global storage chip industry is experiencing a price surge, particularly in the packaging and testing segment, driven by high demand and limited supply [2][4]. Group 1: Price Increases and Market Dynamics - Major storage packaging and testing companies have raised prices by up to 30% due to capacity utilization nearing its limits, with further price hikes anticipated [2][4]. - The advanced packaging index in the A-share market saw significant gains, with companies like Huafeng Measurement Control rising over 7% and Changdian Technology increasing by over 6% [2]. - The price of 8GB DDR4 memory has surged from $1.40 in January last year to $9.30 in December, indicating a substantial increase in memory prices [5]. Group 2: Supply and Demand Imbalance - The core reason for the tight packaging capacity is the strategic focus of major chip manufacturers like Samsung, SK Hynix, and Micron on expanding AI-specific HBM production, which has squeezed the supply of standard DRAM and NAND chips [6]. - The demand for DDR4, DDR5, and NAND chips is strong, particularly from the cloud and industrial control markets, further fueling the need for packaging services [6]. Group 3: Future Outlook and Investments - Goldman Sachs emphasizes that AI remains a key investment theme through 2026, with a focus on high-end packaging and testing sectors [8]. - Micron Technology is set to invest approximately $100 billion in a new semiconductor manufacturing center in New York, aimed at meeting the growing demand for AI systems [8]. - The construction of this facility is expected to create 9,000 jobs and will include multiple factories, with the first expected to be operational by 2030 [8].