SK海力士斥资130亿美元建厂，应对HBM短缺

Group 1 - SK Hynix plans to invest 19 trillion KRW (approximately 12.9 billion USD) to build an advanced packaging factory in response to the surging demand for high bandwidth memory (HBM) driven by AI technology [1][2] - The new facility will focus on advanced packaging technology, which is crucial for enhancing chip performance and energy efficiency, and is expected to be completed by the end of 2027 [1][5] - The HBM market is projected to grow at a compound annual growth rate (CAGR) of 33% from 2025 to 2030, primarily driven by the proliferation of AI applications [5][6] Group 2 - The production process for HBM is more complex than traditional memory, leading to supply tightness and price increases; DRAM prices are expected to rise by 50% to 55% in the upcoming quarter [6][7] - Higher memory prices pose cost challenges for electronics manufacturers but significantly boost the profitability of memory chip producers [7] - SK Hynix's stock has increased by approximately 12% since the beginning of the year, reflecting strong market interest, although it experienced a 2.5% drop in recent trading [7]