Core Viewpoint - The global 8-inch wafer foundry capacity is expected to decrease by 2.4% in 2026 due to TSMC and Samsung Electronics reducing their production capacity, while demand for AI-driven power management chips remains strong, leading to an anticipated increase in capacity utilization rates to 90% this year [2][8]. Group 1: Company-Specific Insights - TSMC plans to gradually exit the 6-inch wafer manufacturing business within two years and continue to reduce 8-inch wafer capacity, with a current monthly capacity of approximately 528,000 wafers [4]. - Samsung Electronics will also reduce its 8-inch wafer production starting in the second half of 2025, aiming to allocate more resources to the 12-inch wafer market, with a similar monthly capacity of 528,000 wafers [4]. - UMC's 8-inch wafer monthly capacity was previously over 360,000 wafers, with a current utilization rate of about 70%, and the company is optimistic about continued growth in 2026 [5]. - SMIC has a monthly capacity of approximately 355,000 8-inch wafers, with a utilization rate of 95.8% as of Q3 2025, and has raised prices by about 10% due to high demand [5]. - Hua Hong Semiconductor's 8-inch wafer foundry utilization rate reached 109.5%, indicating overcapacity, and the company is expanding its production capacity [6]. - Powerchip's 8-inch wafer monthly capacity is around 120,000 wafers, benefiting from the tight supply of memory chips and the recovery of logic process products [6]. - GlobalFoundries is focusing on expanding its 12-inch wafer production, with a projected decline of about 0.3% in global 8-inch wafer foundry capacity in 2025 [7]. Group 2: Market Trends and Projections - The average capacity utilization rate for global 8-inch wafer foundries is expected to rise to 85% to 90% in 2026, significantly better than the 75% to 80% range in 2025 [8]. - Some foundries are notifying customers of price increases ranging from 5% to 20% due to tightening capacity, marking a shift from previous selective price adjustments [8].