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Group 1: Samsung's Strategy in Wafer Production - Samsung plans to close its 8-inch wafer fab S7 to focus on more profitable 12-inch fabs, reflecting a global trend in the semiconductor industry [1][2] - The closure will reduce Samsung's monthly production capacity of 8-inch wafers from 250,000 to below 200,000, with S7 contributing 50,000 wafers [1] - The current utilization rate of Samsung's 8-inch fabs is approximately 70%, as the company shifts focus to 12-inch fabs for key products like CMOS image sensors [1][2] Group 2: Market Dynamics and Competitors - TrendForce predicts a 2.4% decline in global 8-inch wafer fab capacity this year, with TSMC also reducing its capacity [2] - Despite the supply decrease, demand remains strong, particularly for power management ICs used in AI servers, keeping the average utilization rate of global 8-inch fabs between 85% and 90% [2] - DB Hitek may benefit from Samsung's capacity reduction, as it currently operates at full capacity and specializes in small-batch production of various chips [2][3] Group 3: Amkor Technology's Challenges and Opportunities - Amkor Technology plans to close its Hakodate factory in Japan due to weak demand, leading to a significant drop in its stock price [4][5] - The closure is expected to be completed by the end of 2027, with production shifting to existing facilities in Kyushu [4] - Despite recent stock price increases, Amkor faces challenges with declining revenue growth, projected to drop from 15.5% in 2022 to -8.3% in 2023 [9] Group 4: Future Projections for Amkor - Analysts predict Amkor's revenue will rebound to $6.65 billion in 2025, driven by AI demand, with a potential increase in orders from Nvidia [9][10] - The company is investing $7 billion in a new facility in Arizona, supported by $407 million in incentives from the U.S. government, to enhance its advanced packaging capabilities [7][10] - Expected revenue for 2026 is projected at $7.27 billion, with a significant increase in earnings per share anticipated due to investments in advanced packaging [10]