Core Viewpoint - The commercialization of glass substrates, a key technology for next-generation semiconductor packaging, is accelerating, with companies like SK, LG, and Samsung rapidly expanding partnerships with material and process suppliers [1] Group 1: Industry Trends - The competitive landscape has shifted from pure technology research to a value chain battle aimed at large-scale production [1] - Glass substrates are viewed as an ideal alternative for next-generation packaging due to their advantages such as low thermal expansion coefficient, high surface flatness, low signal loss, and high energy efficiency [1] - The increasing prevalence of high-performance, high-integration chips, particularly in artificial intelligence semiconductors, has heightened the importance of precision and stability during the packaging phase [1] Group 2: Company Strategies - SKC, through its subsidiary Absolics, is accelerating preparations for mass production of glass substrates, viewing it as a high-value packaging material that can grow alongside AI semiconductor business [1][2] - Absolics is diversifying its supply sources for photoresists by introducing domestic suppliers and is seeking more partners for glass through-hole (TGV) and electroplating processes [2] - Samsung is actively developing key components for glass substrates through a joint venture with Sumitomo Chemical and has invested in JWMT to support factory expansion and capacity enhancement [2] - LG Innotek is evaluating the glass substrate business as an extension of its existing substrate and packaging operations, collaborating with UTI to develop technology for enhancing glass substrate strength [2] Group 3: Production Challenges - The complexity of glass substrate processes, which include photoresists, glass core materials, hot pressing, electroplating, and tempered glass processing, makes it difficult for a single company to complete all processes independently within a limited timeframe [3] - As mass production plans become clearer, the demand for establishing partnerships to stabilize output and yield is increasing [3] - The competition in the glass substrate field is not about who masters the technology first, but rather who completes the mass-producible structural design first [3]
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半导体行业观察·2026-01-16 01:48