复旦大学最新Nature论文：彭慧胜院士团队开发出首个“纤维芯片”，助力脑机接口/智能织物/VR设备发展

Core Viewpoint - The article discusses the breakthrough in fiber electronics, specifically the development of "fiber chips" that integrate multiple functionalities such as power supply, sensing, display, and signal processing into a single fiber, paving the way for advanced applications in brain-machine interfaces, electronic textiles, and virtual reality wearables [3][12]. Group 1: Research Breakthrough - The research led by Fudan University introduces a novel "fiber chip" that utilizes a multilayered spiral architecture, allowing for large-scale integrated circuits within elastic polymer fibers [3][6]. - This new design approach maximizes the internal space of the fiber, enabling unprecedented micro-device density and multimodal processing capabilities [6]. Group 2: Technical Specifications - The "fiber chip" achieves an integration density of 100,000 transistors per centimeter, meeting the demands of interactive fiber systems [8]. - It can process both digital and analog signals comparable to advanced memory image processors, demonstrating high recognition precision in neural computing [8]. Group 3: Durability and Stability - The "fiber chip" maintains stability under harsh conditions, enduring 10,000 cycles of bending, 30% stretching, 180-degree twisting per centimeter, and even being crushed by a 15.6-ton container truck [10][11]. - This durability allows for the construction of closed-loop systems within a single fiber without the need for external rigid processors [12]. Group 4: Applications and Future Prospects - The flexible fiber system opens pathways for various cutting-edge applications, including brain-machine interfaces, smart textiles, and virtual reality wearables, such as smart tactile gloves for remote surgeries [12].