Core Insights - The article discusses the upcoming "Collaborative Innovation Forum from Devices to Networks," scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the deep integration of the semiconductor and computing power industries [2] - The forum aims to address the challenges of the post-Moore era by promoting collaboration across the entire semiconductor value chain, emphasizing the importance of synergy between semiconductor technology and applications [12][14] Event Overview - The forum is a key event of the Munich Shanghai Optical Expo, co-hosted by Semiconductor Industry Observation and the expo itself, with a mission centered on "collaborative breakthroughs across the semiconductor value chain" [2][4] - It will feature 200 core industry professionals from various sectors, including operators, equipment manufacturers, and data center service providers, ensuring targeted and professional technical exchanges [4][5] Company Spotlight: Xizhi Technology - Xizhi Technology, a leading provider of optoelectronic hybrid computing power, will present its groundbreaking technology at the forum, showcasing its role in driving the upgrade of computing power [2][7] - The company has developed a unique optoelectronic hybrid computing architecture, achieving significant improvements in computing density and energy efficiency compared to traditional electronic computing [8] Technological Innovations - Xizhi Technology's optoelectronic hybrid architecture allows for massive parallel computing, with its core product, the Tian Shu (PACE 2) hybrid computing accelerator card, supporting a matrix size of 128×128 [8] - The company has introduced the first optical interconnect GPU supernode in China, which utilizes a distributed all-optical interconnect chip to overcome limitations in core devices and supply chains [9] Industry Impact - The forum aims to break down barriers between the semiconductor and computing power industries, addressing critical issues such as insufficient computing power, high energy consumption, and interconnect limitations [12] - By leveraging the global resource advantages of the Munich Shanghai Optical Expo, the forum will provide innovative references for local semiconductor companies and practical guidance for small and medium enterprises [16] Collaborative Opportunities - The event will create direct opportunities for technical cooperation and ecosystem building between Xizhi Technology and upstream and downstream enterprises [16] - The dual approach of offline targeted connections and online broad dissemination will enhance the impact of the forum, facilitating efficient channels for technology demonstration and business matching [5][16]
光电混合算力领航者登场:曦智科技携突破性技术亮相2026半导体协同创新论坛
半导体芯闻·2026-01-23 09:38