AI PCB领域应用及企业情况

Core Viewpoint - The rapid growth in demand for servers and switches driven by AI infrastructure is leading to a surge in the need for high-end PCB products such as HDI and high multilayer boards, which are essential for meeting the high load and high-frequency operation requirements of AI applications [2][10]. Group 1: HDI Boards - Definition and Function: HDI boards are high-density interconnect printed circuit boards that achieve complex circuit functions in smaller spaces through higher wiring density and advanced structures like buried and blind vias [3]. - Application Scenarios: HDI boards are crucial for miniaturizing and enhancing the performance of electronic products, widely used in smartphones, 5G base stations, and autonomous vehicles [5]. Group 2: High Multilayer Boards - Definition and Function: High multilayer boards typically have more than 10 layers and are designed to provide sufficient wiring channels and stable electrical environments for complex, high-speed signal systems [6]. - Application Scenarios: These boards are essential components in high-end servers, core communication devices, and applications requiring high reliability, such as aerospace and supercomputers [9]. Group 3: Market Development and Competitive Landscape - Market Growth: The global PCB market is projected to reach $98.4 billion by 2027, with an 8-year CAGR of 6%. In China, the PCB market is expected to grow from 226.7 billion yuan to 346.9 billion yuan from 2019 to 2024, with a 5-year CAGR of 9% [10]. - Competitive Landscape: Leading companies in Japan and Taiwan dominate the high-end PCB and HDI sectors, while top Chinese manufacturers are rapidly emerging in the high-speed multilayer board market [10]. Group 4: Key Domestic Enterprises' Latest Developments - Shenghong Technology: The company is expanding its production capacity for high-end HDI and multilayer PCBs across multiple locations, including factories in Huizhou, Thailand, Vietnam, and Malaysia [13]. - Dongshan Precision: The company has announced a $1 billion investment plan for Multek, with approximately $200 million already invested in upgrading existing facilities [13]. - Shennan Circuit: The company has eight ongoing projects with a total investment of about 17 billion yuan, focusing on high-layer boards and HDI technology [13]. - Unimicron Technology: The company plans to invest 4.3 billion yuan in a project for high-end PCBs to meet the long-term demand from AI and high-speed computing applications [14].