先进封装，为何成2nm后的关键

Core Viewpoint - The semiconductor industry is entering a new phase with the mass production of 2nm processes, where advanced packaging technology is becoming a focal point due to its critical role in chip performance enhancement beyond mere transistor scaling [1]. Group 1: Advanced Packaging - Advanced packaging is not a single technology but a series of solutions aimed at enhancing chip integration, connectivity, and system performance, evolving from traditional packaging to more complex structures like 2.5D and 3D stacking [2]. - This technology does not directly increase chip computation speed but allows for more efficient utilization of computational power, akin to equipping characters with suitable gear to maximize their potential [2]. Group 2: Performance Impact of Connectivity - The layout of connections within advanced chips significantly affects performance, as data movement can consume more power than computation itself; inefficient routing leads to delays and energy waste [3]. - Advanced packaging improves thermal management, which is crucial as chip stacking density increases; effective heat dissipation is essential for maintaining performance levels [3]. Group 3: Differentiated Needs in Applications - Different application scenarios have distinct packaging requirements; AI and data center chips prioritize maximum output and bandwidth, while mobile device chips focus on compactness and power efficiency [4]. - AI chips are designed for high performance, while mobile chips must balance integration and power consumption, reflecting a divergence in packaging strategies [4]. Group 4: Innovations in Materials and Techniques - The industry is exploring glass substrates to replace traditional plastic materials, offering benefits such as finer signal lines and better thermal stability, which can lower production costs by allowing more chips to be packaged simultaneously [5]. - Panel-level packaging (FOPLP) represents a shift towards efficiency by utilizing square packaging instead of circular wafers, maximizing space usage and reducing costs [5].