三星玻璃基板，奔向商用

Core Viewpoint - Samsung Electro-Mechanics has begun commercializing semiconductor glass substrates, marking its entry into the glass substrate market, which is gaining attention as the next generation of semiconductor substrates [1][2]. Group 1: Business Transition and Strategy - The semiconductor glass substrate department has been moved from the Advanced Technology Development Department to the Packaging Solutions Division, indicating a strategic shift towards commercialization [1]. - Samsung Electro-Mechanics appointed Joo Hyuk, former head of the Central Research Institute, as Vice President and head of the Packaging Solutions Division, emphasizing the importance of this transition [1]. - The company aims to accelerate the commercialization process by integrating core glass substrate technology with market supply preparations [1][2]. Group 2: Technological Development and Challenges - Semiconductor glass substrates, which replace existing plastic materials, significantly enhance device performance and are seen as the new substrate for AI semiconductors [1]. - Key technical challenges include signal transmission coatings within the glass and micro-cracks that affect substrate durability and quality, which the company is actively working to overcome [2]. - Samsung Electro-Mechanics plans to collaborate with the materials, components, and equipment (MSE) industry to address these challenges and develop glass substrate samples with global semiconductor companies [2]. Group 3: Market Positioning and Future Outlook - The company established a pilot production line for glass substrates at its Sejong factory last year and formed a joint venture with Sumitomo Chemical to expedite production and supply [2]. - Samsung Electro-Mechanics anticipates that the glass substrate era will truly begin after 2027, with plans to build a supply chain and initiate mass production based on partner demand [2].