盘点 2025 科创板半导体 IPO
是说芯语·2026-02-05 04:41

Core Viewpoint - The article highlights the significant increase in IPO applications on the Sci-Tech Innovation Board, with 48 companies accepted in 2025 compared to only 6 in 2024, particularly emphasizing the semiconductor sector with 20 companies [1]. Group 1: Company Summaries - Angrui Micro, based in Beijing, focuses on RF and analog integrated circuit design and has successfully completed its IPO process, emphasizing domestic substitution in RF and analog chips [1]. - Shanghai Super Silicon specializes in the R&D and production of 300mm and 200mm semiconductor silicon wafers, which are critical substrates for chip manufacturing [1]. - Hengyun Chang, located in Shenzhen, develops plasma RF power systems and devices, essential for advanced chip manufacturing processes [1]. - Chipmi Technology, based in Shanghai, focuses on semiconductor-grade perfluoroether rubber materials, crucial for sealing in semiconductor production [1]. - Zhaoxin Integrated, also in Shanghai, develops high-end general-purpose processors and supporting chips, aiding in domestic chip substitution [2]. - Shanghai Superconductor specializes in high-temperature superconducting materials, enhancing semiconductor device performance [2]. - Youxun Co., based in Xiamen, is a leader in optical communication front-end transceiver chips, recognized as a national champion in manufacturing [2]. - Yadian Technology, located in Jiangsu, develops wet cleaning equipment for silicon-based and compound semiconductors, vital for chip manufacturing precision [3]. - Moer Thread, based in Beijing, focuses on GPU and related products, aligning with high-end industry development needs [3]. - Muxi Co., located in Shanghai, specializes in full-stack GPU products, supporting AI training and general computing [3]. - Qinheng Micro, based in Nanjing, develops interface chips and interconnect MCUs, essential for embedded systems [4]. - Youyan Composite Materials, located in Beijing, produces special non-ferrous metal alloy products for semiconductor packaging [4]. - Lianxun Instruments, based in Suzhou, develops electronic measurement instruments and semiconductor testing equipment [4]. - Lepu Technology, based in Chengdu, focuses on high-end semiconductor equipment, crucial for chip manufacturing [4]. - Zhongke Kehua, located in Jiangsu, specializes in semiconductor packaging materials, impacting chip packaging quality [5]. - Pinzhun Laser, based in Shanghai, develops precision lasers for semiconductor production processes [5]. - Changxin Technology, located in Anhui, focuses on DRAM products, contributing to domestic storage chip production [5]. - Ruishi Chuangxin, based in Chongqing, develops RF front-end chips and modules for various applications [5]. - Taosheng Technology, based in Shanghai, specializes in semiconductor testing interfaces, crucial for product quality assurance [6]. - Zhongtu Technology, located in Dongguan, develops GaN substrates, essential for high-end chips and new energy applications [6]. Group 2: Market Trends and Characteristics - The 20 companies show a significant regional concentration in Shanghai, Jiangsu, Beijing, and Guangdong, indicating a well-developed semiconductor industry ecosystem in these areas [12]. - The companies cover a comprehensive industry chain, including upstream materials, midstream chip design, and downstream testing and packaging, aligning with collaborative industry development trends [12]. - There is a notable profit disparity among the companies, with many in the high R&D investment sectors like chip design operating at a loss, while those in testing and materials are achieving profitability [12].