硅芯科技亮相慕尼黑上海光博会，EDA+解锁产业新路径

Core Viewpoint - The article highlights the upcoming Munich Shanghai Optical Expo as a key platform for the semiconductor and optoelectronics industry, focusing on collaborative innovation from devices to networks, particularly in the context of CPO (Co-Packaged Optics) technology [1][2]. Group 1: Industry Trends - The semiconductor industry is evolving towards "device miniaturization, advanced packaging, and high-speed networking," with collaborative innovation from devices to networks being crucial for overcoming computational and communication bottlenecks [2]. - CPO technology is identified as a pivotal hub connecting "devices, packaging, and networks," necessitating higher requirements for collaborative design due to its role in AI data centers and high-speed interconnect scenarios [2]. Group 2: Challenges in the Industry - The increasing complexity of heterogeneous integration, higher adaptability requirements between devices and networks, and the challenges in design-process-application collaboration are significant pain points hindering large-scale industry advancement [2]. - The bottleneck in CPO development has shifted from optimizing individual components to achieving overall system-level collaboration, which includes considerations for thermal, stress, and signal integrity [2]. Group 3: Company Contributions - Zhuhai Silicore Technology, a leading domestic EDA company, will participate in the forum, showcasing its next-generation 2.5D/3D stacked chip EDA solutions aimed at addressing design bottlenecks in the "device-packaging-network" collaboration [1][3]. - The company's 3Sheng Integration Platform has been validated by leading domestic advanced packaging manufacturers and supports mainstream processes like CoWoS and high-density substrate fan-out, facilitating complex scenarios in silicon photonics integration [3]. Group 4: Forum Highlights - The forum will feature three core technology presentations from Zhuhai Silicore Technology, focusing on EDA solutions for silicon photonics chips, collaborative breakthroughs in CPO technology, and the establishment of an advanced packaging ecosystem [7][9][11]. - The EDA+CPO technology collaboration aims to address core challenges in the entire link, including signal integrity, thermal reliability, and packaging parasitics, facilitating scalable deployment of CPO solutions [9][10]. Group 5: Networking Opportunities - The forum will provide a platform for industry professionals, including semiconductor manufacturers, network equipment vendors, and advanced packaging practitioners, to engage in discussions and find collaborative innovation solutions [15].