又一化工巨头，入局AI数据中心新材料

Core Viewpoint - The competition for computing power in AI large models has intensified, with chip cooling becoming a hidden bottleneck for industry development. New materials and cooling solutions are essential for addressing the increasing power density of high-performance chips [2][4]. Group 1: Company Developments - Xin'an Co., a leader in organic silicon, has partnered with Canxiang Technology to launch an immersion liquid cooling solution, applying self-developed high-performance silicon-based cooling liquid to commercial immersion cooling platforms [2]. - The newly introduced ICL series immersion silicon-based liquid cooling products demonstrate Xin'an's long-term technological foundation, featuring excellent insulation, low viscosity for rapid heat dissipation, and environmental friendliness [5]. - Xin'an's shift from a raw material supplier to a comprehensive solution provider marks a significant transformation in the context of increasing competition in the traditional organic silicon market [7]. Group 2: Market Insights - The liquid cooling market in China is projected to reach 29.3 billion yuan by 2025, with the edge computing market expected to exceed 100 billion yuan [7]. - The phenomenon of high power density in chips is becoming more pronounced across various applications, including electric vehicles, data centers, humanoid robots, and power semiconductors, necessitating advanced cooling solutions [7]. Group 3: Technical Innovations - The immersion cooling solution allows high-performance AI servers to be fully submerged in a special silicon-based cooling liquid, breaking the physical limits of traditional air cooling technology [4]. - The current heat power density on AI processors has reached 1 kW/cm², significantly exceeding the temperatures found in rocket nozzles, highlighting the urgent need for innovative thermal management solutions [5]. - Future chip thermal management will focus on shortening thermal paths and reducing interface thermal resistance, potentially through the introduction of high thermal conductivity materials [8][9].