混合键合，复杂性大增

Core Viewpoint - The article discusses the disruptive potential of hybrid bonding technology in increasing the density and complexity of integrated circuit (IC) products, while also highlighting its environmental implications [2][3]. Group 1: Hybrid Bonding Technology - Hybrid bonding is a revolutionary technology initially applied in CMOS image sensors (CIS) and is now penetrating high-performance computing (HPC) in processors and memory [3]. - The demand for hybrid bonding is expected to grow significantly, with the transition to hybrid bonding in advanced memory being a key market driver by the end of the 2020s [4]. Group 2: Environmental Impact - The number of DRAM chips in each stack is projected to triple, leading to a more than 3.5 times increase in chip emissions [5]. - While hybrid bonding processes may increase emissions at the chip level, the critical issue lies in the significant increase in silicon density, which will lead to higher carbon emissions [9][12]. Group 3: Market Projections - Revenue from hybrid bonding is expected to grow from nearly zero in 2025 to approximately $120 billion by 2029, driven by demand for high-bandwidth memory (HBM), particularly in AI applications [9]. - The emissions from HBM stacks are projected to increase significantly as the complexity of the stacks rises, with emissions per stack expected to grow substantially from HBM2E to HBM5 [13][14]. Group 4: Technical Challenges and Innovations - High-stacking HBM requires thinner DRAM chips and lower thermal budgets, which pose challenges for bonding processes [17]. - Despite these challenges, the demand for hybrid bonding technology remains strong, and innovations in the field are expected to mitigate some of the emission increases [17].