势银观察 | More than Moore推动先进封装bumping加速微缩

Core Insights - The bumping process is increasingly integral to high-density packaging technologies, driving advancements in interconnect density and miniaturization [1][3] - Bumping technology is evolving from C4 bump to finer pitch bumps, microbumps, high copper pillars, and even to bump-less bonding techniques [1][3] Industry Trends - Bumping technology is utilized across a wide range of mid-to-high-end packaging applications, including smartphones, consumer electronics, automotive electronics, and high-performance computing [3] - Bump-less bonding technology is currently limited to specific high-end applications such as HBM5, 3D NAND, 3D CIS, 3D DRAM, 3D SOC, and Micro LED, primarily completed in wafer fabrication rather than packaging [3]