美国正在加速建HBM工厂

Group 1 - SK Hynix will begin full-scale construction of its advanced packaging factory in Lafayette, Indiana, by the end of February 2023, to meet the long-term demand for high bandwidth memory (HBM) in the AI chip sector [1] - The factory is expected to be operational by 2028, with an investment of $4.09 billion, and construction will start with site preparation and civil engineering work [1] - SK Hynix plans to gradually mass-produce the next generation of HBM, starting with the sixth generation (HBM4) this year, and aims to supply approximately 70% of HBM4 for NVIDIA's next AI accelerator, "Vera Rubin" [1] Group 2 - Advanced packaging technology is a critical backend process for HBM production, influencing yield and performance, and its importance is increasing with the rapid development of AI technology [2] - SK Hynix is also expanding its packaging production base in South Korea, planning to invest 19 trillion KRW (approximately $131 billion) to build a new advanced packaging test factory (P&T7), with groundbreaking expected in April this year and completion by the end of next year [2]