一家水下AI芯片公司完成10亿元融资，瞄准大模型推理

Core Viewpoint - The article discusses the rapid development and funding of a 3D AI chip company, 算苗科技 (Suanmiao Technology), which has completed two rounds of financing totaling nearly 1 billion RMB, aimed at developing domestically produced 3D computing chips for AI applications [3][10]. Group 1: Company Overview - 算苗科技 focuses on the research and development of 3D computing chips, with its core product being a customized chip for AI model inference [4]. - The company aims to address the "memory wall" issue that limits AI model computation, as current AI chips face significant inefficiencies due to memory bandwidth constraints [4][5]. - 算苗科技's A4 chip has demonstrated a throughput of 1.26 to 2.19 times that of NVIDIA's H200 in inference tasks on major open-source models [5]. Group 2: Funding and Market Position - The recent funding rounds were led by prominent investors, including Source Code Capital and Shixi Capital, indicating strong market interest and support for the company's vision [3][10]. - The company is positioned to leverage its expertise in 3D IC technology to create a competitive edge in the AI chip market, which is expected to grow significantly [10][19]. Group 3: Technological Innovation - 算苗科技 utilizes a 3D stacked architecture that allows for significantly higher memory bandwidth (up to 32 TB/s), which is crucial for AI model inference [4][13]. - The company’s approach contrasts with traditional GPU architectures, focusing on specialized ASIC designs that optimize performance for specific tasks rather than general-purpose computing [14][15]. Group 4: Strategic Focus - The company has chosen to concentrate on AI model inference rather than training, as it anticipates that 90% of future AI computing demand will be for inference tasks [15][18]. - 算苗科技 believes that the future of AI computing lies in architectural innovation, particularly through 3D stacking and ASIC optimization, which aligns with the growing demand for efficient computing solutions [28][29].