美国拟全面封杀芯片设备售中

Group 1 - The core proposal from U.S. lawmakers aims to upgrade export controls on semiconductor manufacturing equipment to China, focusing on "domestic production capacity" as a criterion for export bans [1] - The proposed measures will close existing loopholes, preventing non-U.S. companies from exporting advanced equipment for 14nm logic chips and 128-layer 3D NAND memory to China without a license [1] - A significant aspect of the proposal includes a maintenance ban, which would cut off U.S. technical support and spare parts for hundreds of billions of dollars worth of imported equipment in China, effectively shortening the equipment's lifecycle [1] Group 2 - The proposal also seeks to establish a multilateral embargo mechanism with allies to prevent China from circumventing technology barriers through reverse engineering of critical equipment subcomponents [1] - The only exemption in the proposal is for equipment that has been localized in China, which undermines the legitimate spare parts supply for foreign chip manufacturers operating in China, conflicting with recent annual export licenses granted [1] - On the same day the letter was revealed, the U.S. Department of Commerce reached a settlement regarding a case involving Applied Materials and equipment smuggling to China, highlighting inconsistencies in enforcement [1]