Chiplet和3D IC，面临新挑战

Core Viewpoint - Reliability has become a system-level issue, encompassing various aspects from materials and packaging to back power testing [2] Group 1: Chiplet and 3D-IC Architecture Challenges - The rapid adoption of chiplet-based architectures in data centers is driving significant changes in design, leading to rising costs and increasing reliability issues [3] - Reliability is the biggest challenge for chiplets and 3D integrated circuits (3D-ICs), as each chiplet may fail individually, necessitating a redesign to meet defect rate targets [4] - The introduction of chiplets and 3D-ICs brings new thermal-mechanical stresses that can affect overall system reliability [5] - Traditional departmental barriers are being broken down, forcing design teams to address material selection issues previously handled by foundries [5] Group 2: Thermal-Mechanical Stress and Reliability - Thermal-mechanical stress, caused by differing coefficients of thermal expansion (CTE) of materials, is a critical concern during chip assembly [12] - The complexity of reliability issues has increased with the introduction of new materials and packaging techniques, requiring chip designers to engage more in material management [13][14] - The reliability of chiplets and 3D-ICs is further complicated by diverse packaging processes and interconnect methods [10] Group 3: Process Technology and Circuit Reliability - Circuit reliability begins with process technology, focusing on the uniformity of FinFETs and nanosheet transistors [15] - Local and global variations in manufacturing processes can lead to significant reliability challenges, necessitating careful design considerations [15] - The need for lower defect parts per million (DPPM) is more critical than ever, especially in the design of standard cells and modules [15] Group 4: System-Level Integration and Verification - The integration of multiple chips in a system requires early consideration of packaging factors, differing from traditional SoC project lifecycles [17] - New EDA solutions and tools are needed to verify interconnect reliability, as failures can occur at any connection point [17] - As system complexity increases, the importance of a holistic approach to reliability management becomes evident [17] Group 5: Future Considerations and Industry Collaboration - The potential of chiplets to transform the semiconductor industry is significant, but they also introduce complex challenges that must be addressed from the early development stages [21] - Continuous collaboration and innovation are necessary to tackle cost and interface intellectual property concerns [21] - Robust verification methods must be prioritized to ensure seamless integration and long-term functionality of chiplet-based systems [21]