半导体材料新势力 IPO 辅导启动,聚焦封装核心部件
是说芯语·2026-02-15 11:52

Core Viewpoint - Yongzhi Co., Ltd. is positioned as a national-level specialized and innovative "little giant" enterprise in the semiconductor chip packaging materials sector, focusing on providing high-performance and reliable packaging material solutions to support the independent and controllable development of the domestic semiconductor industry [2]. Group 1: Company Overview - Yongzhi Co., Ltd. was established on October 15, 2007, with a registered capital of 113.33 million yuan, and is located in Taixing City, Jiangsu Province [1]. - The company specializes in the research, production, and sales of semiconductor chip packaging materials, with core products including lead frames and packaging substrates [2]. Group 2: Product and Technology - The lead frame, a key material in semiconductor packaging, plays crucial roles in electrical connection, mechanical support, and thermal management, while the packaging substrate serves as the core connection bridge between bare chips and external circuits [2]. - Yongzhi's lead frame products are categorized into stamped lead frames and etched lead frames, primarily used in medium to high-power discrete devices across various critical sectors such as consumer electronics, industrial control, new energy, and automotive [2]. Group 3: Market Position and Partnerships - Yongzhi has established itself as a significant supplier to renowned chip manufacturers such as Silan Micro, China Resources Micro, and BYD Semiconductor, and has formed close collaborations with global top ten packaging and testing companies [3]. - The company has been recognized as a qualified supplier by ASE, indicating strong market acceptance [3]. Group 4: Intellectual Property and Future Prospects - As of now, Yongzhi has obtained a total of 128 patents, including 47 invention patents, showcasing its robust research and development capabilities that support product innovation and technological breakthroughs [3]. - Market participants express anticipation for Yongzhi to successfully complete its guidance acceptance and enter the capital market, marking the beginning of a new sustainable development journey [3].

半导体材料新势力 IPO 辅导启动,聚焦封装核心部件 - Reportify