锚定产业趋势，共筑协同生态——《从器件到网络的协同创新论坛》2026年3月上海重磅启幕

Core Viewpoint - The semiconductor industry is undergoing significant structural changes driven by AI, with a global market size expected to reach $975 billion, emphasizing the importance of collaboration across the entire semiconductor value chain to overcome technological bottlenecks and seize structural growth opportunities [1] Part 01: Addressing Industry Changes and Collaboration Challenges - The semiconductor industry is experiencing multiple structural transformations, including rapid iteration of silicon photonics technology from 800G to 1.6T, with a projected penetration rate of over 20% for 1.6T optical modules by 2026 [2] - Domestic computing chips are entering a critical phase of large-scale application, with companies like Haiguang Information and Cambricon achieving multi-scenario deployment [2] - Advanced packaging is becoming a core pathway for performance enhancement in the post-Moore era, with CoWoS capacity continuously expanding [2] - The forum aims to gather 200 key industry players and create a dual-line ecosystem for technology matching and trend dissemination [2] Part 02: Decoding Technological Breakthroughs - The forum's agenda integrates cutting-edge industry trends, featuring insights from academia and industry leaders on the evolution of core semiconductor sectors [3] - Key topics include the integration of optoelectronic chips for information and communication systems, silicon photonics enabling high-speed AI optical connections, and the advantages of silicon capacitors in AI applications [4][5] Part 03: Connecting Trends and Supporting Domestic Initiatives - The forum serves as a platform for technology exchange and a window for industry trends and corporate practices, inviting participants to decode industry trends and build a collaborative ecosystem [8] - Key opportunities include the scaling of 800G/1.6T optical modules and the implementation of CPO technology, with TSMC predicting a 30%-50% cost reduction for CPO by 2026 [8] - The forum will address challenges in domestic supply chain collaboration, particularly in overcoming bottlenecks in SOI wafers and EDA tools [8] Trend Insights and Collaborative Value - Insights from WSTS global semiconductor growth data and Yole's CPO market forecast indicate a potential market size of $8.1 billion by 2030, with a CAGR of 137% [9] - The forum aims to promote collaboration among design, manufacturing, and testing companies to accelerate standardization in silicon photonics packaging, which currently accounts for 60%-70% of industry costs [9] - The event will also focus on the commercialization of domestic computing chips and the entry of RISC-V into data centers, establishing channels for domestic technology validation and resource matching [9]